Image sensor module with passive component

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S432000, C257S434000, C257S680000, C257S730000, C257S731000, C257SE33068, C257S033000, C257S023000

Reexamination Certificate

active

07368795

ABSTRACT:
An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second surface and a penetrated hole. The second surface of the substrate is mounted on the upper surface of the circuit board so that the passive component is located within the penetrated hole. A chip is mounted on the first surface of the substrate, and is located onto the penetrated hole. Wires are electrically connected to the chip and the substrate. A lens holder is mounted on the first surface of the substrate and formed with an internal thread. A lens barrel is formed with an external thread screwed on the internal thread and is formed with an opening, an aspheric lens and an infrared filter.

REFERENCES:
patent: 5821532 (1998-10-01), Beaman et al.
patent: 6686588 (2004-02-01), Webster et al.
patent: 7056756 (2006-06-01), Sugahara et al.
patent: 7105904 (2006-09-01), Choi
patent: 7168161 (2007-01-01), Hanada et al.
patent: 2006/0223216 (2006-10-01), Chang et al.

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