Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2008-09-09
2008-09-09
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S098000, C257S434000, C257S704000, C257S783000, C257S784000, C257SE25032
Reexamination Certificate
active
11283596
ABSTRACT:
An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.
REFERENCES:
patent: 6476417 (2002-11-01), Honda et al.
patent: 2005/0169620 (2005-08-01), Minamio et al.
Ho Mon Nan
Hsin Chung Hsien
Peng Chen Pin
Tu Hsiu Wen
A. Marquez, Esq. Juan Carlos
Fisher Esq. Stanley P.
Kingpak Technology Inc.
Parekh Nitin
Reed Smith LLP
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