Image sensor module structure comprising wire bonding...

Details Image sensor module structure comprising wire bonding... Image sensor module structure comprising wire bonding...

2005-05-11

2009-02-24

Perkey, W. B. (Department: 2862)

Photography

Camera detail

Lens mount

C348S340000

Reexamination Certificate

active

07494292

ABSTRACT:
An image sensor module structure includes an image sensor package, a housing, and an underfiller. The image sensor package includes a substrate having interconnection pads formed on an outermost edge. The housing includes a filter projecting from a bottom surface of a housing body. The projecting filter is attached on an image sensor chip using various adhesive patterns. Further, the underfiller is formed in a space between the housing body and the image sensor package.

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Translation of JP Publication No. 2003-332542 provided.
Translation of JP Publication No. 2003-332542 (Nov. 21, 2003) provided.
English language abstract of Japanese Publication No. 2000-322990.
English language abstract of Japanese Publication No. 2003-197885.

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