Image sensor fabrication method and structure

Details Image sensor fabrication method and structure Image sensor fabrication method and structure

2005-11-15

2005-11-15

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C257S059000, C257S072000, C257S098000, C257SE29282, C349S042000, C349S044000, C349S110000, C349S111000

Reexamination Certificate

active

06964916

ABSTRACT:
A method for processing a semiconductor substrate includes providing a substrate having at least one filter region with a plurality of bond pads in it. Metal is deposited above the bond pads, to reduce the bond pad step height. A planarization layer is formed such that the deposited metal has a height near to a height of the planarization layer. At least one color resist layer is formed above the planarization layer.

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http://www.dpreview.com
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