Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-12-13
1987-05-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29572, 156647, 156648, 156657, 156662, 1563045, H01L 21306, B44C 122
Patent
active
046683330
ABSTRACT:
Apparatus and method of fabricating a sensor array from a (110) silicon substrate having a row of photosites to provide a sensor array chip with uniformly smooth and angled ends designed to permit the chip to be lock butted end to end with other like chips to form a full length scanning array in which the substrate is etched for separation along the (111) planes at the desired boundaries of the chip, the etched boundaries delimiting the chip ends running between selected pairs of photosites to provide whole photosites right up to the ends of the chip so as to avoid any gap or interruption between the photosites at the junctions with other chips.
In a second embodiment, the chip ends are formed with complementary irregular shapes to enhance locating and butting of the chips with one another, and in a third embodiment, grooves are etched between each of the photosites in the row to assure photosite uniformity and prevent cross talk between photosites.
REFERENCES:
patent: 4029962 (1977-06-01), Chapman
patent: 4063268 (1977-12-01), King
patent: 4106046 (1978-08-01), Nathanson et al.
patent: 4418472 (1983-12-01), Lorenze, Jr.
patent: 4604161 (1986-08-01), Araghi
IBM Tech. Discl. Bull.; Crooks et al; vol. 22, No. 6, 11/79; "Long Arrays of Silicon Nozzles".
"On Etching Very Narrow Grooves in Silicon"; Kendall; Applied Physics Ltrs., vol. 26, No. 4, 2/15/75, pp. 195-198.
"Anisotropic Etching of Silicon"; Bean; IEEE Transactions on Electron Devices; vol. ED-25; No. 10; 10/78, pp. 1185-1193.
"Application of Silicon Crystal Orientation and Anisotropic . . . Devices"; Bean et al; IEEE Journal of Solid-State Circuits; vol. SC-9; No. 3; 6/74; pp. 111-117.
"UMOS Transistors on (110) Silicon"; Ammar et al; IEEE Electron Devices; vol. ED-27, No. 5, 5/80; pp. 907-914.
"Detector Pre-Processor for Use With Acousto-Optic Spectrum Analyzer"; Borusk et al; Proceedings of the 1981 Custom Integrated Circuits Conf. May 11-13, 1981; pp. 87-91.
Araghi Mehdi N.
Tandon Jagdish C.
McMullen Frederick E.
Powell William A.
Xerox Corporation
LandOfFree
Image sensor array for assembly with like arrays to form a longe does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Image sensor array for assembly with like arrays to form a longe, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Image sensor array for assembly with like arrays to form a longe will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-701742