Image sensor and method of manufacturing thereof

Details Image sensor and method of manufacturing thereof Image sensor and method of manufacturing thereof

2006-03-08

2009-11-10

Grant, II, Jerome (Department: 2625)

Facsimile and static presentation processing

Facsimile

Picture signal generator

C257S117000, C438S075000, C438S144000

Reexamination Certificate

active

07616356

ABSTRACT:
An image sensor and a method of manufacturing the image sensor, wherein the image sensor can electrically connect a light receiving portion and a printed circuit board (PCB) including circuits by forming holes and filling the holes with a conductive material, without using a wire for the electrical connection between the light receiving portion and the PCB. The light receiving portion converts lights into electrical signals and the PCB electrically processes signals. That is, since a distance for a wire between a sealing structure and because a filter is unnecessary, a thickness may be reduced. Also, since a space for wire bonding is unnecessary on the outside of an image sensor, a fill factor may increase. Also, since a process that may cause contaminates is removed, average yield may increase and production cost may decrease. The manufacturing productivity may be improved.

REFERENCES:
patent: 4692993 (1987-09-01), Clark et al.
patent: 5992769 (1999-11-01), Wise et al.
patent: 6573154 (2003-06-01), Sridhar et al.
patent: 7089798 (2006-08-01), Silverbrook et al.
patent: 7178233 (2007-02-01), Nakamura et al.
patent: 2003-0029027 (2003-04-01), None

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