Image sensor and method of making same

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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Details

C438S069000, C438S781000, C257S432000, C257S440000, C257SE31122

Reexamination Certificate

active

07919350

ABSTRACT:
An image sensor is formed by providing a semiconductor substrate having first, second and third pixel regions and first and second color filters disposed on their respective pixel regions. A photoresist layer is coated over the first and second color filters and the third color pixel region. The photoresist is removed from the first and second color filters, leaving a third color filter of substantially the same height as the first and second color filters. Micro lenses may then be formed on the color filters.

REFERENCES:
patent: 6285065 (2001-09-01), Levy
patent: 6297071 (2001-10-01), Wake
patent: 6818962 (2004-11-01), Yamamoto
patent: 7129108 (2006-10-01), Jang
patent: 2005-142468 (2005-06-01), None
patent: 1020000041458 (2000-07-01), None
patent: 10-2002-0052800 (2002-07-01), None
patent: 1020020052713 (2002-07-01), None
Notice to File a Response/Amendment to the Examination Report and English-language translation issued Nov. 10, 2006 in counterpart Korean application No. 10-2005-0088242.

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