Image sensor and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Reexamination Certificate

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C257SE31038

Reexamination Certificate

active

07825494

ABSTRACT:
An image sensor may include a dielectric, a metal interconnection, an align key, a first substrate, a photodiode, and a transparent electrode. The first substrate may include a pixel region, a peripheral circuitry region and a scribe lane. The dielectric may include a metal interconnection and an align key over the first substrate. The photodiode may be formed over the pixel region and the scribe lane. The transparent electrode may be formed over the photodiode. The align key may have a protrusion formed in a center thereof.

REFERENCES:
patent: 5698892 (1997-12-01), Koizumi et al.
patent: 2005/0031995 (2005-02-01), Kang et al.

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