Image sensor and method for manufacturing the same

Details Image sensor and method for manufacturing the same Image sensor and method for manufacturing the same

2011-05-31

2011-05-31

Sefer, A. (Department: 2893)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C257SE21568

Reexamination Certificate

active

07951690

ABSTRACT:
An image sensor includes circuitry, a metal interconnection, a first substrate, a metal ion-implanted insulating layer, and a photodiode. The circuitry is formed on and/or over the first substrate, and the metal ion-implanted insulating layer is formed on and/or over the metal interconnection. The photodiode is formed in a crystalline semiconductor layer over the metal ion-implanted insulating layer.

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patent: 20060120260 (2006-11-01), None

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