Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2005-12-30
2009-08-25
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C257S098000, C438S070000
Reexamination Certificate
active
07579209
ABSTRACT:
An image sensor includes the steps of forming a sublayer including a photodiode, a transistor and a metal line on a substrate, forming a pattern layer on the sublayer to be overlapped with the photodiode and to having a curved surface, and forming a combined color filter and microlens on the pattern layer to have a curved surface.
REFERENCES:
patent: 6577342 (2003-06-01), Wester
patent: 6861686 (2005-03-01), Lee et al.
patent: 2003/0197228 (2003-10-01), Okuda et al.
patent: 2005/0200734 (2005-09-01), Ahn et al.
patent: 2005/0224694 (2005-10-01), Yaung
patent: 2006/0138480 (2006-06-01), Adkisson et al.
patent: 2006/0261426 (2006-11-01), Hoague et al.
Dongbu Electronics Co. Ltd.
Jahan Bilkis
Louie Wai-Sing
McKenna Long & Aldridge LLP
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