Image preprocessing for probe mark inspection

Details Image preprocessing for probe mark inspection Image preprocessing for probe mark inspection

2007-07-10

2007-07-10

Couso, Jose L. (Department: 2624)

Image analysis

Image segmentation

Reexamination Certificate

active

10443580

ABSTRACT:
Digital image processing methods are applied to an image of a semiconductor interconnection pad to preprocess the image prior to an inspection or registration. An image of a semiconductor pads exhibiting spatial patterns from structure, texture or features are filtered without affecting features in the image not associated with structure or texture. The filtered image is inspected in a probe mark inspection operation.

REFERENCES:
patent: 6208375 (2001-03-01), Kay et al.
patent: 6324298 (2001-11-01), O'Dell et al.
patent: 6937753 (2005-08-01), O'Dell et al.
patent: 6987875 (2006-01-01), Wallack
Ahmed et al., “INSPAD : A System for Automatic Bond Pad Inspection”, IEEE Transactions on Semiconductors Manufacturing, vol. 3, No. 3, Aug. 1990, pp. 145-147.

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