III-V group nitride system semiconductor self-standing...

Active solid-state devices (e.g. – transistors – solid-state diode – Including semiconductor material other than silicon or... – Group iii-v compound

Reexamination Certificate

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C257S613000, C257SE21097, C438S478000, C438S479000

Reexamination Certificate

active

10953354

ABSTRACT:
A III-V group nitride system semiconductor self-standing substrate has III-V group nitride system semiconductor single crystal with a hexagonal crystal system crystalline structure. The substrate is provided with a polished surface at every position of which crystal orientation perpendicular to the substrate surface is inclined 0.09 degrees or more from the C-axis direction of the substrate.

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patent: 2002/0197825 (2002-12-01), Usui et al.
patent: 11-251253 (1999-09-01), None
patent: 2003-165799 (2003-06-01), None
patent: 2003-178984 (2003-06-01), None
Madelung (Editor), Semiconductors—Basic Data, 1996, 2nd Revised Edition, Springer-Verlag, p. 86-90.
Ok-Hyun Nam, et al., “Lateral epitaxy of low defect density GaN layers via organometallic vapor phase epitaxy”, Appl. Phys. Lett., vol. 71, No. 18, Nov. 3, 1997, pp. 2638-2640.
Masaru Kuramoto, et al., Room-Temperature Continuous-Wave Operation of InGaN Multi-Quantum-Well Laser Diodes Grown on an n-GaN Substrate with a Backside n-Contact.
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Yuichi Oshima, et al., “Preparation of Freestanding GaN Wafers by Hydride Vapor Phase Epitaxy with Void-Assisted Separation”, Japan Journal Appl. Phys., vol. 42, Part 2, No. 1A/B, Jan. 15, 2003, pp. L1-L3.
Kensaku Motoki, et al., “Preparation of Large Freestanding GaN Substrate by Hydride Vapor Phase Epitaxy Using GaAs as a Starting Substrate”, Japan Journal Appl. Phys., vol. 40, Part 2, No. 2B, Feb. 15, 2001, pp. L140-L143.

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