Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1975-06-25
1976-09-21
Emery, Stephen J.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156DIG70, 156DIG61, 148172, 118415, 423 87, 423122, B01J 1720, C01B 1900, C01B 2700, C01F 700
Patent
active
039817644
ABSTRACT:
In an epitaxial growth method in liquid phase for III-V compound semiconductor crystals a solution for crystal growth is at first heated to a temperature which is higher than the temperature of crystal growth, and then cooled to that temperature, whereby a part of the solution crystallizes out as small crystals. This solution is separated by means of a filter means into two parts, one of which contains the small crystals and the other of which does not. A substrate crystal is brought into contact with the latter.
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patent: 3690965 (1972-09-01), Bergh
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patent: 3767481 (1973-10-01), Ettenberg
patent: 3792682 (1974-02-01), Phipps
patent: 3896765 (1975-07-01), Ariga
Blum et al., IBM Tech. Disclosure Bulle., vol. 13, No. 11, Apr., 1971, p. 3221.
DeGelormo, IBM Tech. Discl. Bulle., vol. 16, No. 7, Dec., 1973, p. 2158.
Ito Kazuhiro
Kawamura Masao
Morioka Makoto
Ono Yuichi
Emery Stephen J.
Hitachi , Ltd.
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