III-nitride semiconductor fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S602000, C438S046000, C257S077000, C257S011000, C257S078000, C257S189000, C257SE21097, C257SE21098, C257SE21112, C257SE21113, C257SE21121, C257SE21126, C257SE21127, C257SE21138

Reexamination Certificate

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11537304

ABSTRACT:
A process for fabricating a III-nitride power semiconductor device which includes forming a gate structure while providing a protective body over areas that are to receive power electrodes.

REFERENCES:
patent: 6316793 (2001-11-01), Sheppard et al.
patent: 6720586 (2004-04-01), Kidoguchi et al.
patent: 7247889 (2007-07-01), Hanson et al.
patent: 2002/0182839 (2002-12-01), Ogawa et al.
patent: 2005/0173728 (2005-08-01), Saxler
patent: 2007/0023761 (2007-02-01), Robbins
patent: 2007/0141823 (2007-06-01), Preble et al.
International Search Report dated Mar. 25, 2008 issued in PCT Application No. PCT/US06/38678.

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