IGBT or like semiconductor device of high...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S328000, C257S335000, C257S339000, C257S340000, C257S341000, C257S367000, C257S409000, C257S487000, C257S488000

Reexamination Certificate

active

11432907

ABSTRACT:
A multiple-cell insulated-gate-bipolar-transistor chip is disclosed which includes a semiconductor substrate having formed therein a p+-type collector region and an n−-type base region, with a pn junction therebetween. An annular trench is etched in the substrate so as to surround the array of IGBT cells. Received in the trench are a dielectric layer which is held against the base region, and an electroconductive layer which is held against the base region via the dielectric layer and which is electrically coupled to the collector region. When the pn junction between the collector and base regions is reverse biased, the electroconductive layer creates at the annular periphery of the base region a depletion layer which is joined to a depletion layer created in the base region by the pn junction, thereby preventing current leakage from the side surfaces of the IGBT chip.

REFERENCES:
patent: 6057558 (2000-05-01), Yamamoto et al.
patent: 6180966 (2001-01-01), Kohno et al.
patent: 6218217 (2001-04-01), Uenishi et al.
patent: 6462377 (2002-10-01), Hurkx et al.
patent: 6667515 (2003-12-01), Inoue
patent: 6777747 (2004-08-01), Yedinak et al.
patent: 2005/0139909 (2005-06-01), Miura
patent: 2005/0199952 (2005-09-01), Hsieh et al.
patent: 06-069509 (1994-03-01), None

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