IC socket and IC socket assembly

Electrical connectors – With coupling movement-actuating means or retaining means in... – For dual inline package

Reexamination Certificate

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Reexamination Certificate

active

07744396

ABSTRACT:
An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.

REFERENCES:
patent: 5791914 (1998-08-01), Loranger et al.
patent: 6717805 (2004-04-01), Liu et al.
patent: 7080986 (2006-07-01), Ma
patent: 7429182 (2008-09-01), Zheng et al.
patent: 7435119 (2008-10-01), Chang et al.
patent: 07-282931 (1995-10-01), None
patent: 09-178805 (1997-07-01), None
patent: 10-302925 (1998-11-01), None
patent: 2002-280137 (2002-09-01), None
patent: 2005-019284 (2005-01-01), None

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