Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1988-05-19
1989-12-19
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 2372
Patent
active
048879690
ABSTRACT:
An IC socket has a socket body having an IC package accommodating space therein; an IC mounting table disposed in the IC package accommodating space and adapted to support an IC package thereon; and a plurality of contacts planted in a socket body portion at the periphery of the mounting table; the plurality of contacts each having a resilient contact piece, IC terminals of the IC package, when the IC package is supported on the mounting table, being able to contact with the resilient contact pieces of the contacts, wherein the IC package mounting table is formed with a plurality of contact positioning grooves for receiving the resilient contact pieces therein, so that the resilient contact pieces are regulated by a wall for defining the positioning grooves.
REFERENCES:
patent: 3805159 (1974-04-01), Richelmann
patent: 4341433 (1982-07-01), Cherian et al.
patent: 4407555 (1983-10-01), Lockard
patent: 4739257 (1988-04-01), Jenson et al.
Abrams Neil
Yamaichi Electric Mfg. Co. Ltd.
LandOfFree
IC socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1899784