Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1986-12-12
1988-01-05
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 909
Patent
active
047173467
ABSTRACT:
An integrated circuit (IC) socket comprising: a socket body of molded resin having a plurality of recesses for receiving a leadless chip carrier (LCC) type of IC device; and a cover which commonly covers the plurality of recesses for receiving an LCC type of IC device and presses said LCC type of IC device.
REFERENCES:
IBM Bulletin, Betz et al., vol. 9, No. 11, pp. 1510, 4-1967.
Abrams Neil
Fujitsu Limited
LandOfFree
IC socket does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with IC socket, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and IC socket will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-6721