IC-processed microneedles

Details IC-processed microneedles IC-processed microneedles

1997-01-07

1999-01-05

Powell, William

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 56, 216 87, 438745, H01L 2100

Patent

active

058558012

ABSTRACT:
A method of fabricating a microstructure is disclosed. The method includes providing a substrate for forming an interface region and an elongated portion extending away from the interface region. A patterned, non-planar etchable structure is formed on one side of the elongated portion of the substrate. An unetchable membrane layer is deposited atop the etchable structure. At least one etching hole is formed in the membrane layer. The etchable structure is etched by placing an etchant into the etching hole to form a cavity underneath the membrane layer, thereby producing a shaft.

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