IC packing device

Details IC packing device IC packing device

1991-09-11

1993-06-15

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

257666, 257701, 257712, 361398, 361401, 361408, H05K 720

Patent

active

052204863

ABSTRACT:
An IC packing device comprises a semiconductor device, a piece of flexible resin film provided with an opening for receiving the semiconductor, wires arranged on the piece of flexible resin film and slits cut into the piece of film from the edges of the opening. The slits cut into the flexible resin film allow the film to be flexed downward toward the semiconductor, along with the wires which to establish electrical connection with the semiconductor. In this manner, the downwardly bent flexible film provides reduction in the possibility of a wire breaking due to excessive bending of the wire in order to make contact with the semiconductor.

REFERENCES:
patent: 4782589 (1988-11-01), Dennis
patent: 4920454 (1990-04-01), Stopper et al.
patent: 4991001 (1991-02-01), Takubo et al.

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