IC package substrate with over voltage protection function

Details IC package substrate with over voltage protection function IC package substrate with over voltage protection function

2005-02-01

2005-02-01

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S784000, C257S758000, C361S313000

Reexamination Certificate

active

06849954

ABSTRACT:
The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.

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