IC package for high-speed semiconductor integrated circuit devic

Details IC package for high-speed semiconductor integrated circuit devic IC package for high-speed semiconductor integrated circuit devic

1991-02-07

1992-11-10

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

257668, H05K 506

Patent

active

051628961

ABSTRACT:
A tape-automated bonding substrate or TAB substrate used for mounting a gallium arsenide IC chip having external connection terminals including signal input and output terminals thereon is shown. Conductive thin-film wiring lines are formed on an insulative thin-film layer. These thin-film wiring lines include feed-through type signal input wiring lines to be connected to the input terminals of the chip. Each feed-through type signal input wiring line has an inner lead to which a corresponding signal input terminal of the chip is directly connected, a terminal pad for receiving a high-speed input signal, and a terminal pad to which an impedance-matching resistor is to be connected. The feed-through type signal input wiring lines have a composite line structure of micro-strip signal transmission and co-planar signal transmission line structures.

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