IC package and packaging method for the same

Details IC package and packaging method for the same IC package and packaging method for the same

1992-12-30

1996-09-10

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257704, H01L 2302

Patent

active

055548245

ABSTRACT:
Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is put on the package body. Either of an IC chip operated by a single power supply and an IC chip operated by positive and negative power supplies can be packaged without changing the wiring patterns in the package.

REFERENCES:
patent: 4153988 (1979-05-01), Doo
patent: 4539622 (1985-09-01), Akasaki
patent: 4881116 (1989-11-01), Hidada et al.
patent: 5036163 (1991-07-01), Spielberger et al.
patent: 5311048 (1994-05-01), Takahashi et al.
patent: 5315486 (1994-05-01), Fillion et al.
Hatano, "BICMOS Gate Arrays", NEC BIHO, 1990, vol. 43, No. 12, pp. 119-121.

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