IC module having a folding junction structure

Details IC module having a folding junction structure IC module having a folding junction structure

1991-05-31

1992-11-03

James, Andrew J.

Optical: systems and elements

Holographic system or element

Using a hologram as an optical element

361398, 359 81, 257668, 257693, H01L 2348, H01L 2944, H01L 2328, H05K 100

Patent

active

051610094

ABSTRACT:
An IC module includes a film substrate, a plurality of wiring leads, an electrically insulative plastic, and an IC chip. A junction structure of the IC module comprises the IC module, an electronic component, and an electrically conductive bonding compound to couple the IC module to the electronic component. The film substrate is provided with an opening. The plurality of wiring leads are arranged on the film substrate in a manner that some respective portions of the wiring leads bridge the opening provided in the film substrate, the electrically insulative plastic coats the some respective portions of the wiring leads which bridge the opening, and the IC chip is coupled to the wiring leads. The IC module is folded at a part where the some respective portions of the wiring leads bridge the opening.

REFERENCES:
patent: 4514042 (1985-04-01), Nukii et al.
patent: 4631820 (1986-12-01), Harada et al.
patent: 4949158 (1990-08-01), Veda

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