IC module, and wireless information-storage medium and...

Details IC module, and wireless information-storage medium and... IC module, and wireless information-storage medium and...

2005-12-13

2005-12-13

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C257S676000, C361S734000

Reexamination Certificate

active

06974909

ABSTRACT:
An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.

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EPO Search Report dated Oct. 6, 2003.
Chinese Office Action.
U.S. Appl. No. 10/780,856, Inagaki et al., filed Aug. 19, 2004.

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