Communications: radio wave antennas – Antennas – Spiral or helical type
Patent
1999-02-22
2000-12-12
Wong, Don
Communications: radio wave antennas
Antennas
Spiral or helical type
257679, 235491, H01L 2302, H01Q 136, G06K 1906
Patent
active
061605263
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to an IC module which is a component of an IC-card used as an ID card or the like. It also relates to an IC-card including such an IC module.
BACKGROUND ART
An IC-card having an IC memory is known as a card having an information storage function. Recently, a non-contact IC-card has been in practical use as a prepaid card for use of ski lifts or the like. Such an IC-card includes an IC chip incorporated in a card member made of a synthetic resin. More particularly, the IC-card comprises an IC module which is incorporated in a card member made of a synthetic resin and having a predetermined thickness, and the IC-card module comprises an electronic circuit including an IC memory and an antenna coil.
The antenna coil not only provides its inherent function as an antenna for transmitting and receiving radio waves but also has a function of supplying a drive power to the IC chip by inductively generating an electromotive force upon receiving radio waves. Therefore, an IC-card incorporating an antenna coil can eliminate the need for incorporating a power source. Such an IC-card requires a further thickness reduction.
A conventional antenna coil utilizes a wire-wound coil formed of a metal wire. The wire-wound coil has a structure in which the metal wire is wound about 50 turns, for example, so that it has a large thickness. If the number of wire turns is reduced in order to reduce the thickness of the wire-wound coil, the properties of the antenna may be degraded. Consequently, the wire-wound coil becomes inevitably bulky, and there is a limitation on the thickness reduction of an IC-card. Further, in manufacturing the IC-card, the wire-wound coil and the IC chip, prepared separately, need to be aligned with each other, and the ends of the wire-wound coil must be connected to the electrodes of the IC chip in such a manner that they do not positionally deviate relative to each other. Accordingly, the series of the manufacturing steps is very complicated to result in a poor production efficiency. Furthermore, the wire-wound coil is liable to disconnection when the IC-card is deformed under bending for example.
DISCLOSURE OF THE INVENTION
An object of the present invention is to provide an IC module and an IC-card capable of solving or reducing the above problems.
A first aspect of the present invention provides an IC module. The IC module comprises a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip, wherein the antenna coil includes a conductive film which is patterned on a surface of the substrate.
Preferably, the IC chip has a main surface formed with a pair of electrodes for antenna connection. The antenna coil includes a spiral portion having a plurality of spiral turns. The substrate is provided with a pair of terminals disposed inwardly of the spiral portion in connection to starting and terminating ends, respectively, of the antenna coil. The IC chip is mounted on the substrate with the pair of electrodes connected to the pair of terminals.
Preferably, the antenna coil further includes a bent extension which extends inwardly of the spiral portion from the respective spiral turns. The bent extension includes the starting and terminating ends of the antenna coil, whereby the pair of terminals are located inwardly of the spiral portion.
Preferably, the bent extension has an inner end interposed between the starting and terminating ends of the antenna coil.
Preferably, the main surface of the IC chip is rectangular in plan view. The pair of electrodes for antenna connection are disposed at corners of the main surface on a common diagonal line.
Preferably, the main surface of the IC chip is provided with at least one dummy electrode. The substrate is provided with a dummy terminal corresponding to the dummy electrode, and the dummy electrode is connected to the dummy terminal.
Preferably, the substrate comprises a flexible substrate made of a resin film as a base material.
Preferably, the IC module furthe
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patent: 5541399 (1996-07-01), De Vall
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patent: 5852289 (1996-12-01), Masahiko
Hirai Minoru
Horio Tomoharu
Miyata Osamu
Ueda Shigeyuki
Clinger James
Rohm & Co., Ltd.
Wong Don
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