Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2000-01-04
2001-04-10
Lee, Eddie C. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S532000, C257S535000, C257S690000
Reexamination Certificate
active
06215171
ABSTRACT:
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to an IC module having one or more integrated circuits and a package surrounding them.
Innumerable versions of such IC modules have been known for many years, and require no further explanation.
It is also known that, in some cases, when operating integrated circuits, effects occur which can interfere with operation of the relevant integrated circuit and/or of integrated circuits located in the vicinity thereof, unless appropriate countermeasures are taken.
One such effect can be observed, for example, during switching processes in driver stages of the type shown in
FIG. 4
, which will be discussed in detail below. Such circuits cannot be used easily and cause problems, especially at very high frequencies and operating speeds.
SUMMARY OF THE INVENTION
It is accordingly an object of the invention to provide an IC module, which overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type in such a way that it can be used easily and without any problems even at very high frequencies and operating speeds.
With the foregoing and other objects in view there is provided, in accordance with the invention, an IC module, comprising at least one integrated circuit; a base in the form of a platelet disposed on the at least one integrated circuit, the base formed of a material selected from the group consisting of glass and ceramic; a passive component carried by the base; and a package jointly surrounding the component and the base.
The invention accordingly provides that one or more additional electronic components are accommodated on a base, inside the package of the IC module, in the immediate vicinity of the integrated circuit and that the base is a glass or ceramic platelet.
In consequence, electronic components which are required for the integrated circuit to operate and behave correctly can be disposed in the immediate vicinity of those points at which the effects to be avoided or to be compensated for are initiated or occur.
Therefore, inter alia, the back-up capacitors can also be disposed in the immediate vicinity of those points at which the previously described short-circuits occur.
Fitting the back-up capacitors in the immediate vicinity of these points has the positive effect of permitting the charges stored in the back-up capacitors to be made available essentially immediately, and to be replaced essentially without any delay, virtually irrespective of the signal frequencies and the operating speed. This means that, in any case if the back-up capacitors are constructed to be sufficiently large, it is not possible for any brief supply voltage collapses to occur.
An IC module has thus been found which can be used without any problems even at very high frequencies and operating speeds.
In accordance with another feature of the invention, the passive components are produced as co-fired ceramic and formed on the base.
In accordance with a further feature of the invention, there is provided a capacitor area formed on the base, the capacitor area including a multiplicity of capacitors. In accordance with an added feature of the invention, at least some of the capacitors in the capacitor area have a common substrate electrode or cover electrode.
In accordance with an added feature of the invention, the base is bonded to the integrated circuit. In accordance with an additional feature of the invention, bond pads are disposed on the base, and the passive components are disposed on the base and are to be connected to the integrated circuit by the bond pads. In accordance with yet another feature of the invention, the base has an edge at which the bond pads are disposed. In accordance with a concomitant feature of the invention, there are provided bonding wires connected to the bond pads and meeting the bond pads relatively flat.
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in an IC module nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.
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Cruz Lourdes
Greenberg Laurence A.
Infineon - Technologies AG
Lee Eddie C.
Lerner Herbert L.
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