Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-12-06
2005-12-06
Smith, Matthew (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000, C326S041000, C326S047000, C326S101000
Reexamination Certificate
active
06973634
ABSTRACT:
Some embodiments of the invention provide a region of an integrated-circuit (“IC”) layout that has a plurality of interconnect layers, where at least one particular layer has more than one preferred interconnect direction. In some of these embodiments, the region has several interconnect layers that have more than one preferred wiring direction each.
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U.S. Appl. No. 10/066,060, filed Jan. 31, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, the present application is a CIP of this application.
U.S. Appl. No. 10/066,160, filed Jan. 31, 2002, Steven Teig et al., Per the preliminary amendment dated May 30, 2003, the present application is a CIP of this application.
U.S. Appl. No. 10/066,095, filed Jan. 31, 2002, Steven Teig et al., Per the preliminary amedment dated May 30, 2003, the present application is a CIP of this application.
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U.S. Appl. No. 10/061,641, filed Jan. 31, 2002, Steven Teig et al., This application has the same specification and drawings (with the exception of the claims, summary, and abstract) as U.S. Appl. Nos. 10/066,060, 10/066,160, 10/066,095, 10/066,047, 10/066,094, 10/062,995, 10/066,102, 10/066,187.
U.S. Appl. No. 10/066,094, filed Jan. 31, 2002, Steven Teig et al., Per the preliminary amendment dated May 30, 2003, the present application is a CIP of this application.
U.S. Appl. No. 10/076,121, filed Feb.12, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, the present application is a CIP of this application.
U.S. Appl. No. 10/062,995, filed Jan. 31, 2002, Steven Teig et al., Per the preliminary amendment dated May 30, 2003, the present application is a CIP of this application.
U.S. Appl. No. 10/066,102, filed Jan. 31, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, the present application is a CIP of this application.
U.S. Appl. No. 10/066,187, file
Caldwell Andrew
Jacques Etienne
Teig Steven
Cadence Design Systems Inc.
Kik Phallaka
Smith Matthew
Stattler, Johansen and Adeli LLP
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