IC chip for different type IC packages

Details IC chip for different type IC packages IC chip for different type IC packages

1994-04-18

1996-12-17

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257692, 257697, H01L 2348

Patent

active

055856764

ABSTRACT:
An IC chip characterized in that at least two input pads and at least two output pads are respectively disposed symmetrical to each other about the center of the IC chip, at least two input/output pads are disposed symmetrical to each other about the center, at least one supply voltage pad is disposed in each of four equal sections formed by longitudinally and laterally dividing the IC chip, and at least one control voltage pad is disposed in each of these four sections. The IC chip can be connected by bonding to various types of IC packages having different configurations of the pins only by mounting in a proper direction without causing the bonding wires to bridge over the other constituent elements or to cross each other.

REFERENCES:
patent: 4860087 (1989-08-01), Matsubara et al.
patent: 5036163 (1991-07-01), Spielberger
patent: 5165067 (1992-11-01), Wakefield
patent: 5311043 (1994-05-01), Stockmaier
GaAs MESFET Circuit Design (Artech House 1988) pp. 497-509.
Advanced GaAs MMIC Technology (Microwave Exhibition & Publisher Ltd. 1993) pp. 277-280.

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