IC chip and semiconductor device

Details IC chip and semiconductor device IC chip and semiconductor device

2005-02-01

2005-02-01

Mandala, Jr., Victor A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Contacts or leads including fusible link means or noise...

C257S529000, C257S786000, C257S528000

Reexamination Certificate

active

06849929

ABSTRACT:
An IC chip has externally and selectively cuttable members F1-F3, which can be cut, or cut open, at more than one cuttable points C1and C2. So long as at least one of the multiple cuttable points C1and C2remains cut open, the cuttable member works as a cut member. Thus, a cut member has an exceedingly small probability that it is short-circuited by particles in an ACF or by dust.

REFERENCES:
patent: 4587638 (1986-05-01), Isobe et al.
patent: 5608257 (1997-03-01), Lee et al.
patent: 5703817 (1997-12-01), Shiratake et al.
patent: 6163062 (2000-12-01), Shiratake et al.
patent: 6278128 (2001-08-01), Noji et al.
patent: 6664174 (2003-12-01), Ema et al.
patent: 61268220 (1986-11-01), None
patent: 63122150 (1988-05-01), None
patent: 63122150 (1988-05-01), None
patent: 63289335 (1988-11-01), None

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