IC card having adhesion-preventing sheets

Details IC card having adhesion-preventing sheets IC card having adhesion-preventing sheets

1990-07-17

1994-07-05

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257678, 257687, 235487, 235488, 235492, 174 524, H01L 2302, H01L 2312, G06K 1900

Patent

active

053270100

ABSTRACT:
An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.

REFERENCES:
patent: 4725924 (1988-02-01), Juan
patent: 4727246 (1988-02-01), Hara et al.

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