I/O pad adhesion layer for a ceramic substrate

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

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Details

428629, 428660, 428680, 428672, 428674, 428675, 428647, 428648, B32B 1504, H01L 2348

Patent

active

055320317

ABSTRACT:
A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.

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patent: 4998157 (1991-03-01), Yokayama et al.

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