I/O pad adhesion layer for a ceramic substrate

Details I/O pad adhesion layer for a ceramic substrate I/O pad adhesion layer for a ceramic substrate

1992-01-29

1996-07-02

Nguyen, Ngoc-Yen

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428629, 428660, 428680, 428672, 428674, 428675, 428647, 428648, B32B 1504, H01L 2348

Patent

active

055320317

ABSTRACT:
A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer which may be Au or Pt. Also disclosed are low yield stress solders of Sn/Sb, Sn/Ag, Sn/Cu and Sn/Cu/Ti.

REFERENCES:
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patent: 3106489 (1963-10-01), Lepselter
patent: 3390969 (1968-07-01), Sullivan et al.
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4514751 (1985-04-01), Battacharya
patent: 4643875 (1987-02-01), Mizuhara
patent: 4693770 (1987-07-01), Hatada
patent: 4835593 (1989-05-01), Arnold et al.
patent: 4998157 (1991-03-01), Yokayama et al.

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