Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1995-08-16
1997-04-08
Pirlot, David L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439925, H01R 909
Patent
active
056181841
ABSTRACT:
An input/output connector module for connecting input and output devices to a multi-wire bus having a first stage. The first stage electrically connects directly to the multi-wire bus, and a second stage is supported on the first stage and carries an IC chip. The second stage includes electrical connections for connecting the input and output devices to the IC chip and for connecting the multi-wire bus to the IC chip for conveying the signals between the multi-wire bus and the input and output devices. The second stage further includes a substrate having positioning cavities for locating the second stage with respect to the first stage in a horizontal direction and the surface of the substrate includes cutout portions for locating the second stage with respect to the first stage in a vertical direction. The cutout portions are elongated strips along opposite sides of the substrate with one positioning cavity being semi-circular and disposed essentially in the middle of one of the elongated strips. The first stage includes an elongated, cylindrical member and pins in mating contact with the positioning cavities.
REFERENCES:
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patent: 5044964 (1991-09-01), Minerd et al.
patent: 5125846 (1992-06-01), Sampson
patent: 5181852 (1993-01-01), Dambach et al.
patent: 5415556 (1995-05-01), Schroll
patent: 5435734 (1995-07-01), Chow
patent: 5452183 (1995-09-01), Renn et al.
Minerd Timothy M.
Rall David W.
Biggi Brian J.
Chapuran R. F.
Pirlot David L.
Xerox Corporation
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