Semiconductor chip interposer module with engineering change wir

Details Semiconductor chip interposer module with engineering change wir Semiconductor chip interposer module with engineering change wir

1991-12-13

1993-01-05

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

361412, 361414, 361401, 257684, 257698, 257701, 257723, 257731, H01L 2302, H01L 2312

Patent

active

051775948

ABSTRACT:
A semiconductor package is described for supporting and interconnecting semiconductor chips, each chip having contact lands on a contact surface, the package also including a substrate with a contact surface. An interposer module is disposed between at least one chip's contact surface and the substrate's contact surface. The interposer module has first and second opposed surfaces and a first plurality of contact locations positioned on its first surface which mate with a chip's contact land. A second plurality of contact locations on the interposer modules second surface are positioned to mate with contact lands on the substrate. A set of conductive vias are positioned within the interposer module and connect the first plurality of contact locations with a first subset of the second plurality of contact locations. A distributed capacitance layer is positioned within the interposer and is adjacent to its first surface. Adjacent to the second surface are X and Y lines which can be used to make engineering change interconnections.

REFERENCES:
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4328530 (1982-05-01), Bajorek et al.
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4489364 (1984-12-01), Chance et al.
patent: 4688151 (1987-08-01), Kraus et al.
patent: 4744008 (1988-05-01), Black et al.
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 4926241 (1990-05-01), Carey
"Engineering change method not requiring pads", IBM TDB vol. 29, No. 4, Sep. 1986, pp. 1694-1695.
IBM TDB Oct. 1975 vol. 18, No. 5, pp. 1440-1441.
IBM TDB Feb. 1982 vol. 24, No. 9, pp. 4637-4638.
IBM TDB Feb. 1984 vol. 26, No. 9, pp. 4590-4591.
IBM TDB Jan. 1985 vol. 27, No. 8, pp. 4672-4673.
IBM TDB Sep. 1987, vol. 30, No. 4, pp. 1786-1787.

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