I-line photoresist compositions

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4302861, 4302871, 430905, 430920, 522 63, G03F 7038

Patent

active

059103949

ABSTRACT:
Negative photoimageable compositions are disclosed which contain a radiation sensitive component for producing an acid when subjected to radiation at wavelengths of 320 to 420 nanometers, a resin binder and a reactive oligomer. The compositions are useful in constructing printed circuits and integrated circuit packages.

REFERENCES:
patent: 3954475 (1976-05-01), Bonham et al.
patent: 4189323 (1980-02-01), Buhr
patent: 4232106 (1980-11-01), Iwasaki et al.
patent: 4826753 (1989-05-01), Higashi et al.
patent: 5034304 (1991-07-01), Feely
patent: 5057397 (1991-10-01), Miyabe et al.
patent: 5128232 (1992-07-01), Thackeray et al.
patent: 5298364 (1994-03-01), Pawlowski et al.
patent: 5340697 (1994-08-01), Yoshimoto et al.
patent: 5366846 (1994-11-01), Knudsen et al.
patent: 5368783 (1994-11-01), Kobayashi et al.
patent: 5719008 (1998-02-01), Hozumi et al.
JP 63075737 A2--Chemical Abstract only--Date of Ref. Abstracted Apr. 1988.
JP 05,281,727--Chemical Abstract only--Date of Ref. Abstracted Oct. 1993.
JP 05,303,196--Chemical Abstracted only--Date of Ref. Abstracted Nov. 1993.
JP 2,100,392--Chemical Abstracted only--Dated of Ref. Abstracted Feb. 1994.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

I-line photoresist compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with I-line photoresist compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and I-line photoresist compositions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1682659

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.