Hyperbga buildup laminate

Details Hyperbga buildup laminate Hyperbga buildup laminate

2005-04-12

2005-04-12

Whitehead, Jr., Carl (Department: 2813)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S750000, C361S767000, C361S771000, C361S774000, C361S792000, C174S250000, C174S255000, C174S261000, C174S262000, C174S264000

Reexamination Certificate

active

06879492

ABSTRACT:
A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers (N ≧2) and N metal planes formed in the following sequence: dielectric layer1on a metallic plane that exists on a surface of the substrate, metal plane1on dielectric layer1, dielectric layer2on dielectric layer1and metal plane1, metal plane2on the dielectric layer2, . . . , dielectric layer N on dielectric layer N-1and metal plane N-1, and metal plane N on the dielectric layer N. Metal planes or metallic planes may include signal planes, power planes, ground planes, etc. A microvia structure, which is formed through the N dielectric layers and electrically couples metal plane N to the metallic plane, includes a microvia or a portion of a microvia through each dielectric layer.

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