Hydroxy-amino thermally cured undercoat for 193 nm lithography

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S281100, C430S322000, C430S330000, C525S328800, C525S353000, C525S375000

Reexamination Certificate

active

10863424

ABSTRACT:
The present invention is directed to a thermally curable polymer composition, and a photolithographic substrate coated therewith, the composition comprising a hydroxyl-containing polymer, an amino cross-linking agent and a thermal acid generator. The thermally curable polymer composition may be dissolved in a solvent and used as an undercoat layer in deep UV lithography.

REFERENCES:
patent: 4454274 (1984-06-01), Singer et al.
patent: 4788127 (1988-11-01), Bailey et al.
patent: 5208133 (1993-05-01), Tsumori
patent: 5227276 (1993-07-01), Roeschert et al.
patent: 5230985 (1993-07-01), Lohaus et al.
patent: 5266424 (1993-11-01), Fujino et al.
patent: 5288741 (1994-02-01), Bender et al.
patent: 5292614 (1994-03-01), Ochiai et al.
patent: 5304456 (1994-04-01), Ueda et al.
patent: 5318878 (1994-06-01), Jones et al.
patent: 5340697 (1994-08-01), Yoshimoto et al.
patent: 5376504 (1994-12-01), Graziano et al.
patent: 5445850 (1995-08-01), Das et al.
patent: 5494777 (1996-02-01), Shiraki et al.
patent: 5514755 (1996-05-01), Fenn et al.
patent: 5529885 (1996-06-01), Ochiai et al.
patent: 5536835 (1996-07-01), Randon et al.
patent: 5541263 (1996-07-01), Thackeray et al.
patent: 5585219 (1996-12-01), Kaimoto et al.
patent: 5585220 (1996-12-01), Breyta et al.
patent: 5585222 (1996-12-01), Kaimoto et al.
patent: 5627010 (1997-05-01), Pai et al.
patent: 5738972 (1998-04-01), Padmanaban et al.
patent: 5773190 (1998-06-01), Oie et al.
patent: 5780206 (1998-07-01), Urano et al.
patent: 5789136 (1998-08-01), Sato et al.
patent: 5800964 (1998-09-01), Sato et al.
patent: 5985524 (1999-11-01), Allen et al.
patent: 6054248 (2000-04-01), Foster et al.
patent: 6165697 (2000-12-01), Thackeray et al.
patent: 6316165 (2001-11-01), Pavelchek et al.
patent: 6323287 (2001-11-01), Foster et al.
patent: 6410209 (2002-06-01), Adams et al.
patent: 6602652 (2003-08-01), Adams et al.
patent: 2002/0007018 (2002-01-01), Foster et al.
patent: 2002/0009670 (2002-01-01), Thackeray et al.
patent: 2002/0022196 (2002-02-01), Pavelchek et al.
patent: 2002/0031729 (2002-03-01), Trefonas et al.
patent: 2002/0173594 (2002-11-01), De et al.
patent: 2002/0197556 (2002-12-01), Huang et al.
patent: 0813114 (1997-12-01), None
patent: A-06-118631 (1994-04-01), None
patent: A-07-278234 (1995-10-01), None
patent: A-08-211620 (1996-08-01), None
patent: A-10-142793 (1998-05-01), None
patent: A-10-168132 (1998-06-01), None
patent: A-10-221855 (1998-08-01), None
patent: A-10-319593 (1998-12-01), None
patent: A-11-038622 (1999-02-01), None
patent: A-2002-530696 (2002-09-01), None
patent: WO 97/07145 (1997-02-01), None
patent: WO 98/21038 (1998-05-01), None
patent: WO 98/52225 (1998-11-01), None
patent: WO 99/11457 (1999-03-01), None
patent: WO 99/40624 (1999-08-01), None
patent: WO 00/54105 (2000-09-01), None
European Search Report Jan. 23, 2006.
Silicon in Organic, Organometallic and Polymer Chemistry, Brook, Michael p. 480, 482 (John Wiley and Sons, 2000).
High Resolution 248 nm, Bilayer Resist, Proc., Q. Lin, K. Petrillo & G. Breytaa et al. SPIE, p. 241.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hydroxy-amino thermally cured undercoat for 193 nm lithography does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hydroxy-amino thermally cured undercoat for 193 nm lithography, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hydroxy-amino thermally cured undercoat for 193 nm lithography will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3761145

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.