Hydrogen ion microlithography

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430325, 430326, 430327, 2504723, 156628, G03C 500

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active

049606751

ABSTRACT:
Disclosed is a hydrogen ion microlithography process for use in microelectronic fabrication and semiconductor device processing. The process comprises the steps of providing a single layer of either an amorphous silicon or hydrogenated amorphous silicon material. A pattern is recorded in a selected layer of amorphous silicon or hydrogenated amorphous silicon materials by preferentially implanting hydrogen ions therein so as to permit the selected layer to serve as a mask-resist wafer suitable for subsequent development and device fabrication. The layer is developed to provide a surface pattern therein adaptable for subsequent use in microelectronic fabrication and semiconductor device processing.

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Cambria et al., "Mask and Circuit Repair with Focused-Ion Beams", Solid State Techn., 1987, pp. 133-136.
Grenier, "Wafer Fabrication Equipment Five Year Forecast", Solid State Techn., 1988, pp. 67-70.
Marche et al., "Amorphous Silicon as an Inorganic Resis", SPIE vol. 471, Electronbeam, X-Ray and Ion Beam Techniques for Submicron Lithographies III, 1984, pp. 60-65.
O'Connell, "Formation of Resistive Films by Ion Bombardment", IEE Colloquim of Ion Implantation, 1970, p. 7 Peters, Semiconductor International, 1988, pp. 96-100.
Thurber, Semiconductor International, 1988, p. 15.
Tsuo et al., "Ion Beam Hydrogenation of Amorphous Silicon", Appl. Phys. Lett. 51(18), 1987, pp. 1436-1438.

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