Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-12-03
1992-02-18
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
134 31, 134102, 156657, 156345, B44C 122, C03C 1500, C03C 2506
Patent
active
050890840
ABSTRACT:
An apparatus used to HF gas etch a plurality of integrated circuit wafers within an etch chamber, followed by a de-ionized water cascade rinse in the chamber. On completion of the rinse and removal of the wafer carriers, the apparatus, housing, and supply conduits are purged with an inert gas to prepare the apparatus for a next batch of wafer carriers. The apparatus includes process-control means for automatically controlling each step of the process.
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patent: 4682614 (1987-07-01), Silvernail et al.
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patent: 4691722 (1987-08-01), Silvernail et al.
patent: 4749440 (1988-06-01), Blackwood et al.
patent: 4900395 (1990-02-01), Syverson et al.
Chhabra Navjot
Gibbons Loyal
Crowder, Jr. Albert M.
Micro)n Technology, Inc.
Powell William A.
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