Hydantoin or barbituric acid-extended epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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528117, 528118, C08L 6302

Patent

active

050066153

ABSTRACT:
A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which have the following formula, ##STR1## (b) a mono-nucleus chain extending agent containing N-heterocyclic fatty groups and at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).

REFERENCES:
patent: 3793248 (1974-02-01), Porret et al.
patent: 3963666 (1976-06-01), Schreiber et al.
patent: 4124760 (1978-11-01), Green et al.
patent: 4672101 (1987-06-01), Wang et al.

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