Hybrid orientation SOI substrates, and method for forming...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With specified crystal plane or axis

Reexamination Certificate

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C257S064000, C257S347000, C257S521000, C257S527000, C257S628000, C257SE21036, C257SE21233, C257SE29003, C257SE29004, C257SE29105, C438S198000

Reexamination Certificate

active

07834425

ABSTRACT:
The present invention relates to a hybrid orientation semiconductor-on-insulator (SOI) substrate structure that contains a base semiconductor substrate with one or more first device regions and one or more second device regions located over the base semiconductor substrate. The one or more first device regions include an insulator layer with a first semiconductor device layer located atop. The one or more second device regions include a counter-doped semiconductor layer with a second semiconductor device layer located atop. The first and the second semiconductor device layers have different crystallographic orientations. Preferably, the first (or the second) device regions are n-FET device regions, and the first semiconductor device layer has a crystallographic orientation that enhances electron mobility, while the second (or the first) device regions are p-FET device regions, and the second semiconductor device layer has a different surface crystallographic orientation that enhances hole mobility.

REFERENCES:
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patent: 7226833 (2007-06-01), White et al.
patent: 7538390 (2009-05-01), Wang et al.
patent: 2004/0256700 (2004-12-01), Doris et al.
patent: 2006/0145264 (2006-07-01), Chidambarrao et al.
patent: 2007/0037329 (2007-02-01), Kelman
patent: 2007/0090467 (2007-04-01), Zhu
Yang, M. et al. “High Performance CMOS Fabricated on Hybrid Substrate With Different Crystal Orientations.”Technical Digest of International Electron Devices Meeting, pp. 453, 2003.

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