Hybrid/microwave enclosures and method of making same

Details Hybrid/microwave enclosures and method of making same Hybrid/microwave enclosures and method of making same

1990-09-27

1992-08-11

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, 295921, 228120, 228178, 228179, H01L 2302, B23K 3102

Patent

active

051381141

ABSTRACT:
A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.

REFERENCES:
patent: 3813758 (1974-06-01), Araki
patent: 3823299 (1974-07-01), Metcalfe et al.
patent: 4227036 (1980-10-01), Fitzgerald
patent: 4266090 (1981-05-01), Scherer
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4614836 (1986-09-01), Carpenter et al.
patent: 4649229 (1987-03-01), Scherer et al.
patent: 5001299 (1991-03-01), Hingorany

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