Hybrid integrated circuit with a spacer between the radiator pla

Details Hybrid integrated circuit with a spacer between the radiator pla Hybrid integrated circuit with a spacer between the radiator pla

1996-11-26

1998-06-30

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

257712, 257713, 361702, 361704, 361707, H01L 2334, H05K 720

Patent

active

057738980

ABSTRACT:
A hybrid integrated circuit is provided with a radiator plate having a power device fixed at the surface through a spacer. As the spacer for preventing heat transfer from the radiator plate to the substrate, the solder layer has at least one supporting element selected from the group consisting of (1) globular metal grains of 80 to l200 .mu.m in diameter uniformly distributed therein, (2) a first solder layer of 50 to 200 .mu.m applied on the lower surface of the radiator, and (3) a dummy layer of 80 to 150 .mu.m high including at least one selected from the group consisting of a resistor layer, conductive layer and a glass layer on the radiator loading part.

REFERENCES:
patent: 4504849 (1985-03-01), Davies et al.

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