Hybrid integrated circuit device with apertured cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Patent

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Details

257687, 257688, 257704, 257787, H01L 2302, H01L 2322, H01L 2348, H01L 2312

Patent

active

054731917

ABSTRACT:
A hybrid integrated circuit device is constructed by injecting a protective resin 10 into a ring 9 enclosing functional elements 802-804 mounted on an integrated circuit board 8, and by providing a plate-like cover member 11 having variously shaped openings 12 overlying the resin.

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