Hybrid integrated circuit device and method of manufacturing...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S827000, C029S832000, C029S840000, C264S272150

Reexamination Certificate

active

07152316

ABSTRACT:
To provide a hybrid integrated circuit device in which the rear surface of a circuit board is exposed to the outside and a method of manufacturing the same. Here, leads are fixed to the surface of the circuit board along one side thereof. A method of manufacturing a hybrid integrated circuit device includes the steps of forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board and a circuit element electrically connected to the conductive pattern, fixing a lead to a pad formed of the conductive pattern, housing the circuit board in a cavity of molds, and fixedly supporting the lead by clamping the lead between the molds, and performing sealing by filling inside of the cavity with sealing resin with the rear surface of the circuit board made in contact with an inside bottom surface of the molds.

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patent: 04-007866 (1992-01-01), None
patent: 6-177295 (1994-06-01), None

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