Hybrid integrated circuit device

Details Hybrid integrated circuit device Hybrid integrated circuit device

2007-02-06

2007-02-06

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

With textured surface

C257S773000, C257S528000, C257SE23015

Reexamination Certificate

active

10347010

ABSTRACT:
A semiconductor device is provided wherein conductive paths40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin44, and the back surface of the conductive path40is exposed through the insulating resin44and sealed. With this arrangement, fractures of the conductive paths40embedded in the insulating resin44are suppressed.

REFERENCES:
patent: 4447857 (1984-05-01), Marks et al.
patent: 5045408 (1991-09-01), Williams et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5493075 (1996-02-01), Chong et al.
patent: 5559364 (1996-09-01), Hojyo
patent: 5580466 (1996-12-01), Tada et al.
patent: 5629563 (1997-05-01), Takiar et al.
patent: 5736789 (1998-04-01), Moscicki
patent: 5796590 (1998-08-01), Klein
patent: 5835988 (1998-11-01), Ishii
patent: 5841192 (1998-11-01), Exposito
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 6001671 (1999-12-01), Fjelstad
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6037786 (2000-03-01), Palagonia
patent: 6042682 (2000-03-01), Funaya et al.
patent: 6063139 (2000-05-01), Fukaya
patent: 6177718 (2001-01-01), Kozono
patent: 6228676 (2001-05-01), Glenn et al.
patent: 6274404 (2001-08-01), Hirasawa et al.
patent: 6329605 (2001-12-01), Beroz et al.
patent: 6329715 (2001-12-01), Hayashi
patent: 6377464 (2002-04-01), Hashemi et al.
patent: 6414506 (2002-07-01), Akram et al.
patent: 6483180 (2002-11-01), Bayan et al.
patent: 59-208756 (1984-11-01), None
patent: 2-96374 (1990-04-01), None
patent: 2-240940 (1990-09-01), None
patent: 3-94430 (1991-04-01), None
patent: 03-094431 (1991-04-01), None
patent: 3-94431 (1991-04-01), None
patent: 08-70079 (1996-03-01), None
patent: 8-130283 (1996-05-01), None
patent: 08-204103 (1996-08-01), None
patent: 09-074149 (1997-03-01), None
patent: 9082741 (1997-03-01), None
patent: 09-283688 (1997-10-01), None
patent: 11-126952 (1999-05-01), None
patent: 11-163024 (1999-06-01), None
patent: 11-195733 (1999-07-01), None
patent: 11-195742 (1999-07-01), None
patent: 2000-15331 (2000-01-01), None
patent: 2000-150760 (2000-05-01), None
patent: 2001-110945 (2001-04-01), None
patent: 2003-522416 (2003-07-01), None
VSLI (Chinese text).

Affiliated with

Also associated with

Rating

Hybrid integrated circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hybrid integrated circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hybrid integrated circuit device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3871601