Hybrid integrated circuit chip package

Details Hybrid integrated circuit chip package Hybrid integrated circuit chip package

1987-07-06

1988-09-27

Scott, J. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 74, 357 79, 357 81, 361388, 361414, H05K 720

Patent

active

047746327

ABSTRACT:
A hybrid integrated circuit chip package is disclosed which includes a hybrid, low loss, multilayer metallization, silicon printed wiring board as an interconnecting, two-sided module to reduce the length of interconnections between integrated circuit chips positioned on opposite sides of the module.

REFERENCES:
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4498122 (1985-02-01), Rainal
patent: 4541035 (1985-09-01), Carlson etal.
Ho et al., "Multiple LSI Silicon Chip Modules with Power Bases Composed of Laminated Silicon Sheets with Metallized Upper and Lower Surfaces", IBM Technical Disclosure Bulletin, vol. 22, No. 8A, 1/80, pp. 3410-3411.

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