Hybrid circuit structures and methods of fabrication

Details Hybrid circuit structures and methods of fabrication Hybrid circuit structures and methods of fabrication

1992-03-11

1994-02-01

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437190, 437195, 437228, 437235, 148DIG103, 148DIG106, H01L 2100

Patent

active

052829227

ABSTRACT:
Hybrid circuit structures and methods of fabrication particularly suitable for the fabrication of high density multi-layer interconnects utilizing silicon substrates are disclosed. In accordance with the method, a layer of alumina is put down over the silicon substrate, typically having an oxide layer thereover, which layer of alumina acts as a blocking barrier to any subsequent plasma etching process for etching polymer layers thereover during the subsequent high density multilayer interconnect fabrication steps. Various representative high density multi-layer interconnect structures on silicon substrates and methods of forming the same are disclosed, including the inclusion of an adhesion enhancement layer over the layer of alumina to enhance the adhesion of a polymer which would not otherwise adhere well directly to the layer of alumina.

REFERENCES:
patent: 3844831 (1974-10-01), Cass et al.
patent: 4592801 (1986-06-01), Hara et al.
patent: 4686000 (1987-08-01), Heath
patent: 4731318 (1988-03-01), Roche et al.
patent: 4767724 (1988-08-01), Kim et al.
patent: 4789648 (1988-12-01), Chow et al.

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