Hub for supporting high capacity memory subsystem

Details Hub for supporting high capacity memory subsystem Hub for supporting high capacity memory subsystem

2011-04-05

2011-04-05

Doan, Duc T (Department: 2185)

Electrical computers and digital processing systems: memory

Storage accessing and control

Access timing

Reexamination Certificate

active

07921271

ABSTRACT:
A high-capacity memory subsystem architecture utilizes multiple memory modules arranged in one or more clusters, each attached to a respective hub which in turn is attached to a memory controller. Within a cluster, data is interleaved so that each data access command accesses all modules of the cluster. The hub communicates with the memory modules at a lower bus frequency, but the distributing of data among multiple modules enables the cluster to maintain the composite data rate of the memory-controller-to-hub bus. Preferably, the memory system employs buffered memory chips having dual-mode operation, one of which supports a cluster configuration in which data is interleaved and the communications buses operate at reduced bus width and/or reduced bus frequency to match the level of interleaving.

REFERENCES:
patent: 5893927 (1999-04-01), Hovis
patent: 6502161 (2002-12-01), Perego et al.
patent: 7120723 (2006-10-01), Jeddeloh
patent: 7120727 (2006-10-01), Lee et al.
patent: 7136958 (2006-11-01), Jeddeloh
patent: 7188219 (2007-03-01), Jeddeloh
patent: 7378868 (2008-05-01), Tyhach et al.
patent: 7397684 (2008-07-01), Ruckerbauer et al.
patent: 7411843 (2008-08-01), Ruckerbauer et al.
patent: 7477717 (2009-01-01), Kuzmenka et al.
patent: 2002/0023191 (2002-02-01), Fudeyasu
patent: 2002/0084458 (2002-07-01), Halbert et al.
patent: 2003/0093641 (2003-05-01), Kahn et al.
patent: 2004/0243769 (2004-12-01), Frame et al.
patent: 2004/0256638 (2004-12-01), Perego et al.
patent: 2005/0144403 (2005-06-01), Jeddeloh
patent: 2005/0210216 (2005-09-01), Jobs et al.
patent: 2006/0245226 (2006-11-01), Stewart
patent: 2006/0265533 (2006-11-01), Hobson et al.
patent: 2007/0079057 (2007-04-01), Ruckerbauer et al.
patent: 2007/0124532 (2007-05-01), Bennett
patent: 2008/0077732 (2008-03-01), Risse
patent: 2008/0250270 (2008-10-01), Bennett
patent: 1628225 (2006-02-01), None
U.S. Appl. No. 11/459,956, filed Jul. 26, 2006, “Daisy Chained Memory System”.
U.S. Appl. No. 11/459,957, filed Jul. 26, 2006, Memory System Having Self Timed Daisy Chained Memory Chips.
U.S. Appl. No. 11/459,969, filed Jul. 26, 2006, “Carrier Having Daisy Chained Memory Chips”.
U.S. Appl. No. 11/459,983, filed Jul. 26, 2006, “Carrier Having Daisy Chain of Self Timed Memory Chips”.
U.S. Appl. No. 11/459,994, filed Jul. 26, 2006, “Daisy Chainable Memory Chip”.
U.S. Appl. No. 11/459,997, filed Jul. 26, 2006, “Daisy Chainable Self Timed Memory Chip”.
U.S. Appl. No. 11/459,974, filed Jul. 26, 2006, “Computer System Having Daisy Chained Memory Chips”.
U.S. Appl. No. 11/459,968, filed Jul. 26, 2006, Computer System Having Daisy Chained Self Timed Memory Chips.
U.S. Appl. No. 11/459,966, filed Jul. 26, 2006, “Memory Controller for Daisy Chained Memory Chips”.
U.S. Appl. No. 11/459,961, filed Jul. 26, 2006, “Memory controller for Daisy Chained Self Timed Memory Chips”.
U.S. Appl. No. 11/459,943, filed Jul. 26, 2006, “Memory Chip Having an Apportionable Data Bus”.
U.S. Appl. No. 11/459,947, filed Jul. 26, 2006, “Self Timed Memory Chip Having an Apportionable Data Bus”.
U.S. Appl. No. 11/459,955, filed Jul. 26, 2006, “Computer System Having an Apportionable Data Bus”.
U.S. Appl. No. 11/459,959, filed Jul. 26, 2006, “Memory System Having an Apportionable Data Bus and Daisy Chained Memory Chips”.

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