Hotplate offset ring

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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Details

118725, H05B 368, C23C 1600

Patent

active

061005053

ABSTRACT:
There is provided a hotplate offset ring of a unique construction for use in a heat treatment unit of wafer track system so as to achieve a more uniform heat transfer. In a preferred embodiment, this is achieved by a plurality of spacer tabs formed on the offset ring which prevent the possibility of non-uniformities in a gap formed between the wafer and the hotplate by eliminating any raised surfaces.

REFERENCES:
patent: 5434090 (1995-07-01), Chiou et al.
patent: 5474612 (1995-12-01), Sato et al.
patent: 5583736 (1996-12-01), Anderson et al.
patent: 5756964 (1998-05-01), Hsu et al.
patent: 5938850 (1999-08-01), Arami et al.

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