Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1999-05-27
2000-08-08
Paik, Sang
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
118725, H05B 368, C23C 1600
Patent
active
061005053
ABSTRACT:
There is provided a hotplate offset ring of a unique construction for use in a heat treatment unit of wafer track system so as to achieve a more uniform heat transfer. In a preferred embodiment, this is achieved by a plurality of spacer tabs formed on the offset ring which prevent the possibility of non-uniformities in a gap formed between the wafer and the hotplate by eliminating any raised surfaces.
REFERENCES:
patent: 5434090 (1995-07-01), Chiou et al.
patent: 5474612 (1995-12-01), Sato et al.
patent: 5583736 (1996-12-01), Anderson et al.
patent: 5756964 (1998-05-01), Hsu et al.
patent: 5938850 (1999-08-01), Arami et al.
Advanced Micro Devices , Inc.
Chin Davis
Paik Sang
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